Umboniso we-LEDuphuhliso lweshishini ukuza kuthi ga ngoku, kubandakanywa umboniso weCOB, kuye kwavela iintlobo ngeentlobo zeteknoloji yokupakisha imveliso.Ukususela kwinkqubo yesibane yangaphambili, ukuya kwi-table paste (SMD) inkqubo, ukuya ekuveleni kwe-COB iteknoloji yokupakisha, kwaye ekugqibeleni ukuvela kwe-GOB yokupakisha iteknoloji.
SMD: izixhobo ezixhonywe phezulu.Izixhobo ezifakwe kumphezulu.iimveliso ezikhokelwayo ezipakishwe nge-SMD(iteknoloji yesitikha setafile) ziikomityi zesibane, izixhaso, iiseli zekristale, iileyile, iireyini ze-epoxy kunye nezinye izinto ezifakwe kwiinkcukacha ezahlukeneyo zamaso wesibane.I-bead yesibane idityaniswe kwibhodi yesiphaluka nge-welding ephezulu yokushisa i-reflow welding kunye nomshini we-SMT okhawulezayo, kunye neyunithi yokubonisa enezithuba ezahlukeneyo zenziwa.Nangona kunjalo, ngenxa yobukho beziphene ezinzulu, ayikwazi ukuhlangabezana neemfuno zangoku zemarike.Iphakheji ye-COB, ebizwa ngokuba yi-chips ebhodini, iteknoloji yokusombulula ingxaki yokutshatyalaliswa kobushushu obukhokelela.Xa kuthelekiswa ne-in-line kunye ne-SMD, ibonakaliswe ngokugcinwa kwendawo, ukupakishwa okulula kunye nolawulo olusebenzayo lwe-thermal.I-GOB, isifinyezo seglue ebhodini, iteknoloji ye-encapsulation eyenzelwe ukuxazulula ingxaki yokukhusela ukukhanya okukhokelwayo.Yamkela imathiriyeli entsha evulelekileyo yokufaka i-substrate kunye neyunithi yokupakisha ekhokelwayo ukwenza ukhuseleko olusebenzayo.Izinto eziphathekayo azikho nje ngokucacileyo, kodwa zine-conductivity ephezulu ye-thermal.Isithuba esincinci se-GOB sinokuziqhelanisa nayo nayiphi na indawo engqongileyo enzima, ukufezekisa ubungqina bokwenyani bomswakama, ukungangeni kwamanzi, ubungqina bothuli, i-anti-impact, i-anti-UV kunye nezinye iimpawu;Iimveliso ze-GOB zokubonisa ngokubanzi zigugile kwiiyure ezingama-72 emva kokuhlanganisana nangaphambi kokuncamathisela, kwaye isibane sivavanywa.Emva kwegluing, ukuguga ezinye iiyure ezingama-24 ukuqinisekisa umgangatho wemveliso kwakhona.
Ngokuqhelekileyo, ukupakishwa kwe-COB okanye i-GOB kukufakela izinto zokupakisha ezicacileyo kwiimodyuli ze-COB okanye ze-GOB ngendlela yokubumba okanye i-gluing, ukugqiba i-encapsulation yemodyuli yonke, yenza ukhuseleko lwe-encapsulation yomthombo wokukhanya, kwaye wenze indlela ebonakalayo ebonakalayo.Umphezulu wemodyuli yonke sisibuko somzimba ocacileyo, ngaphandle kokugxila okanye unyango lwe-astigmatism kumphezulu wemodyuli.Umthombo wokukhanya wenqaku ngaphakathi kumzimba wepakethe uyabonakala, ke kuya kubakho ukukhanya kwe-crosstalk phakathi komthombo wokukhanya.Okwangoku, ngenxa yokuba i-optical medium phakathi komzimba wepakethe ecacileyo kunye nomoya ongaphezulu wahlukile, isalathiso se-refractive ye-transparent body body sikhulu kunomoya.Ngale ndlela, kuya kubakho ukubonakaliswa okupheleleyo kokukhanya kujongano phakathi komzimba wepakethe kunye nomoya, kwaye ukukhanya okuthile kuya kubuyela ngaphakathi kumzimba wepakethe kwaye kulahleke.Ngale ndlela, intetho enqamlezayo esekelwe kukukhanya okungentla kunye neengxaki ze-optical ezibonakaliswe emva kwiphakheji ziya kubangela inkunkuma enkulu yokukhanya, kwaye ikhokelela ekunciphiseni okubonakalayo kwe-LED / GOB yokubonisa umahluko wemodyuli.Ukongezelela, kuya kubakho umehluko wendlela ye-optical phakathi kweemodyuli ngenxa yeempazamo kwinkqubo yokubumba phakathi kweemodyuli ezahlukeneyo kwimodi yokupakisha yokubumba, eya kubangela ukuhluka kombala obonakalayo phakathi kweemodyuli ezahlukeneyo zeCOB / GOB.Ngenxa yoko, umboniso okhokelwayo ohlanganiswe yiCOB/GOB uya kuba nomehluko onzulu wombala wokubonwayo xa isikrini simnyama kunye nokungabikho kokumahluko xa isikrini siboniswa, okuya kuchaphazela umphumo wokubonisa kwesikrini sonke.Ngokukodwa kumboniso omncinci we-HD, lo msebenzi wokubonwayo ubi kakhulu.
Ixesha lokuposa: Dec-21-2022
